MueTec develops high precision, optical measurement and inspection solutions that help customers in the semiconductor and microelectronics industries to improve their manufacturing yield and overall process control. Our team of technical experts listen to, respond to and anticipate the needs of wafer, reticle and MEMS manufacturers worldwide, offering customized and standard solutions at extremely low maintenance requirements. Scalable systems allow for a combination of many different applications in a single system, including critical dimension, overlay and film thickness measurement as well as defect inspection and review. Over the last 20 years, MueTec has installed 300 measurement and inspection systems around the world.


METROLOGY 

CD / Overlay / Film Thickness / Infrared Metrology / Mask Metrology 

DAVINCI 200IR & 300IR –INFRARED (IR) SOLUTIONS FOR CD, OVERALY AND INSPECTION 

200mm MEMS inspection and metrology system (SMIF) 

Typical Applications

  • Sealing Inspection after bonding (eutectic bonding or glass frit bonding)
  • Device Inspection after bonding
  • Overlay Metrology after bonding
  • Critical Dimension Metrology after bonding

Features

  • Best inclassIR image quality with wafelengths of up to 1500nm
  • Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers
  • Combined reflected & transmitted light illumination modes
  • SECS/GEM

DAVINCI 270UV – MASK CD METROLOGY 

Typical Applications: Critical Dimension Metrology

Features

  • Cost effective solution for mask layers with feature sizes of 300nm and above
  • UV and visable light capability
  • Reflected and transmitted light
  • Highest quality opticcs
  • Flexible tool configurations available
  • CD repeatability (3 sigma) long term < 4 nm (etched layer)

MT3000 – WAFER METROLOGY 

Fully automated metrology and inspection system (open cassette)

Typical Applications

  • CD
  • Overlay
  • Film Thickness
  • Defect Inspection
  • Defect Review

Features

  • VIS, UV
  • Simultaneous wafer handling 75 - 200mm
  • SECS/GEM


INSPECTION 

Macro Defect Inspection/ Post-sawn Framed Wafer Inspection/ Micro Defect Inspection/ Defect Review/ Infrared (IR) Inspection/ Mask Inspection

ARGOS – HIGH THROUGHPUT MACRO INSPECTION 

Argos 150, Argos 200 

200mm Wafer Macro Defect Inspection

Features

  • Simultaneous bright- and darkfield front and backside inspection
  • Unique, optimized wafer handling for a throughput 200 wafer/HR
  • Enables productivity gains through minimum recipe customization
  • Ideal for fabs and packaging areas with many different devices & die sizes
  • No knowledge about geometry and physical parameters needed
  • Die layout data is not necessary
  • Recognition of active die area and EBR zone
  • Different sensitivities for different wafer areas
  • Avoiding false positives at zone transitions
  • Automatic adjustment of light intensity
  • Reflectivity of inspected layer is not necessary
  • Automatic defect recognition parameters by adaptive software algorithm
  • Simulaneous wafer frontside and backside inspection

Argos 300 

200mm/300mm Wafer Macro Defect Inspection

Features

  • Automatic defect recognition parameters by adaptive software algorithm
  • Reflectivity of inspected layer is not necessary
  • Automatic adjustment of light intensity
  • Avoiding false positives at zone transitions
  • Different sensitivities for different wafer areas
  • Recognition of active die area and EBR zone
  • Die layout data is not necessary
  • No knowledge about geometry and physical parameters needed
  • Ideal for fabs and packaging areas with many different devices & die sizes
  • Enables productivity gains through minimum recipe customization
  • Modular design with 1 – 3 process chambers, depending on throughput requirements
  • Simultaneous bright- and darkfield front and backside inspection
  • Data acquisition perfectly balanced to mechanical movements
  • 300 mm FOUP based handling

Argos 300-F

Post-saw Framed Wafer Inspection

With a high throughput of 110 300mm wafer on a 380mm frame, the system inspects many different defect types, from sawing line failures to defects on the foil and on the frame.

Features

  • Simultaneous brightfield and dark field inspection
  • Data acquisition perfectly balanced to mechanical movements
  • Optimized for multi-zone inspection of wafer, foil and frame.
  • 380 mm framed wafer FOUP based handling

REMBRANDT – HIGH RESOLUTION MACRO INSPECTION 

Rembrandt 200 / 300 

200mm MEMS inspection and metrology system (SMIF) 

Typical Applications: Macro defect inspection of 200mm and 300mm wafer

Features

  • 200mm SMIF or 300 mm FOUP based handling
  • Data acquisition perfectly balanced to mechanical movements
  • Illumination: Bright and darkfield, LED based
  • Black/white and colored image of sample
  • Modular system architecture results in small footprint
  • Design allows addition of 3rd module and 4th FOUP
  • Throughput optimized & balanced system integration avoids bottlenecks

SPECTOR – MASK DEFECT INSPECTION

Spector 

Automatic and fully enclosed with FFUShow details

Features

  • Fully enclosed tool architecture
  • Robot handling of masks with up to 2 pod or cassette stations
  • Automatic inspection based on die-to-die comparison
  • Resolution of 0,5 μ/pixel
  • Defect sizes as of 1 μm
  • Mask sizes up to 14''

Spector A 

Automatic with mask robot and mask carriers

Features

  • Open tool architecture
  • Robotor mask loading and unloading
  • Fully automatic mask inspection
  • Automatic inspection based on die-to-die comparison
  • Resolution as of 0,5 μ/pixel
  • Defect sizes as of 1 μm
  • Mask sizes up to 14''

Spector M 

Semi Automatic

Features

  • Open tool architecture

  • Manual operator mask loading and unloading
  • Automatic inspection based on die-to-die comparison
  • Resolution as of 0,5 μ/pixel
  • Defect sizes as of 1 μm
  • Mask sizes up to 14''

CUSTOMIZED SOLUTIONS 

Si-Wafer / Mask/ MEMS/ Water Level Packaging/ Plastic Electronics/ LED, OLED/ Application Specific Solutions