MueTec develops high precision, optical measurement and inspection solutions that help customers in the semiconductor and microelectronics industries to improve their manufacturing yield and overall process control. Our team of technical experts listen to, respond to and anticipate the needs of wafer, reticle and MEMS manufacturers worldwide, offering customized and standard solutions at extremely low maintenance requirements. Scalable systems allow for a combination of many different applications in a single system, including critical dimension, overlay and film thickness measurement as well as defect inspection and review. Over the last 20 years, MueTec has installed 300 measurement and inspection systems around the world.

METROLOGY

CD / Overlay / Film Thickness / Infrared Metrology / Mask Metrology

DAVINCI 200IR & 300IR –INFRARED (IR) SOLUTIONS FOR CD, OVERALY AND INSPECTION

200mm MEMS inspection and metrology system (SMIF)

Typical Applications

Sealing Inspection after bonding (eutectic bonding or glass frit bonding)
Device Inspection after bonding
Overlay Metrology after bonding
Critical Dimension Metrology after bonding

Features

Best inclassIR image quality with wafelengths of up to 1500nm
Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers
Combined reflected & transmitted light illumination modes
SECS/GEM

DAVINCI 270UV – MASK CD METROLOGY

Typical Applications: Critical Dimension Metrology

Features

Cost effective solution for mask layers with feature sizes of 300nm and above
UV and visable light capability
Reflected and transmitted light
Highest quality opticcs
Flexible tool configurations available
CD repeatability (3 sigma) long term < 4 nm (etched layer)

MT3000 – WAFER METROLOGY

Fully automated metrology and inspection system (open cassette)

Typical Applications

CD
Overlay
Film Thickness
Defect Inspection
Defect Review

Features

VIS, UV
Simultaneous wafer handling 75 - 200mm
SECS/GEM

INSPECTION

Macro Defect Inspection/ Post-sawn Framed Wafer Inspection/ Micro Defect Inspection/ Defect Review/ Infrared (IR) Inspection/ Mask Inspection

ARGOS – HIGH THROUGHPUT MACRO INSPECTION

Argos 150, Argos 200

200mm Wafer Macro Defect Inspection

Features

Simultaneous bright- and darkfield front and backside inspection
Unique, optimized wafer handling for a throughput 200 wafer/HR
Enables productivity gains through minimum recipe customization
Ideal for fabs and packaging areas with many different devices & die sizes
No knowledge about geometry and physical parameters needed
Die layout data is not necessary
Recognition of active die area and EBR zone
Different sensitivities for different wafer areas
Avoiding false positives at zone transitions
Automatic adjustment of light intensity
Reflectivity of inspected layer is not necessary
Automatic defect recognition parameters by adaptive software algorithm
Simulaneous wafer frontside and backside inspection

Argos 300

200mm/300mm Wafer Macro Defect Inspection

Features

Automatic defect recognition parameters by adaptive software algorithm
Reflectivity of inspected layer is not necessary
Automatic adjustment of light intensity
Avoiding false positives at zone transitions
Different sensitivities for different wafer areas
Recognition of active die area and EBR zone
Die layout data is not necessary
No knowledge about geometry and physical parameters needed
Ideal for fabs and packaging areas with many different devices & die sizes
Enables productivity gains through minimum recipe customization
Modular design with 1 – 3 process chambers, depending on throughput requirements
Simultaneous bright- and darkfield front and backside inspection
Data acquisition perfectly balanced to mechanical movements
300 mm FOUP based handling

Argos 300-F

Post-saw Framed Wafer Inspection

With a high throughput of 110 300mm wafer on a 380mm frame, the system inspects many different defect types, from sawing line failures to defects on the foil and on the frame.

Features