MueTec develops high precision, optical measurement and inspection solutions that help customers in the semiconductor and microelectronics industries to improve their manufacturing yield and overall process control. Our team of technical experts listen to, respond to and anticipate the needs of wafer, reticle and MEMS manufacturers worldwide, offering customized and standard solutions at extremely low maintenance requirements. Scalable systems allow for a combination of many different applications in a single system, including critical dimension, overlay and film thickness measurement as well as defect inspection and review. Over the last 20 years, MueTec has installed 300 measurement and inspection systems around the world.
Inspection Products
Closed Frame Tools
ARGOS 200-F SiC
Used in: BACK - END
Key Differences: F=Frame; SiC = Silicon Carbide Technology
Key Features: Macro Defect Inspection; Optimized for SiC material
ARGOS 150HT / 200HT
Used in:
Front - END (Lithography)
Key Differences: HT = High Throughput
Key Features: Simultaneous wafer handling from 2 open cassette ports for high throughput; Small footprint; Recipeless operation
ARGOS 200-F / 300-F
Used in: Back - END
Key Differences:
Handling of framed wafer, fully SECS/GEM 300 compliant
Key Features:
Post-Sawn framed wafer inspection; 200mm or 300mm framed wafer handling; Recipeless operation
ARGOS 200 / 300
Used in:
Front - END (Lithography)
Key Differences:
200 or 300 mm Wafer
Key Features:
Macro Defect Inspection; FOUP based handling
Open Frame Tools
SPECTOR-A
Used in: Front - END
Key Differences:
Fully-automated for mask sizes up to 9"
Key Features:
Defect inspection from masks; Recipeless operation
SPECTOR-M
Used in: Front - END
Key Differences:
Semi-automated for mask sizes up to 9"
Key Features:
Defect inspection from masks;
Recipeless
IRIS 2100
Used in: Front - END
Key Differences:
Fully-automated for wafer sizes up to 200mm
Key Features:
Metrology and Inspection from wafer with visible and infrared illuminations
Metrology Products
Closed Frame Tools
DaVinci 300 iOVL
Used in: Front - END
Key Differences: Tool for 300mm wafer
Key Features:
Metrology (overlay, critical dimension) - optimized for overlay measurement; 90nm node
DaVinci 200 iOVL
Used in: Front - END
Key Differences: Tool for 200mm wafer
Key Features:
Metrology (overlay, critical dimension) - optimized for overlay measurement; 130nm node
DaVinci 150/200
Used in: Front - END
Key Differences: Tool for 150mm or 200mm Wafer
Key Features:
Metrology (overlay, critical dimension); film thickness measurement
DaVinci 200IR/300IR
Used in: Front - END
Key Differences: Fully automated infrared tool for wafer sizes up to 300 mm
Key Features:
Metrology (Critical Dimension and overlay) for wafer; Visible and infrared Illumination; for mems wafer with high doping levels
Open Frame Tools
MT 3000VIS/UV
Used in: Front - END
Key Differences: Fully-automated for wafer sizes up to 200mm
Key Features:
Metrology (overlay, critical dimension) and inspection with visible and UV illumination; film thickness measurement
MT 2010
Used in: Front - END
Key Differences: Semi-automated for wafer sizes up to 200mm
Key Features:
Metrology (overlay, critical dimension) with visible illumination; film thickness measurement
MT 270UV
Used in: Front - END
Key Differences: Semi-automated for Mask sizes up to 9"
Key Features:
CD-measurements on masks with visible and UV-illumination.
Customised Solutions
Almost every tool is customised
As part of our business model, we serve customers who need metrology and inspection solutions that do not exist in the market. Our dedicated group of mechanical engineers, software developers and application engineers listen to your requirements and come up with proposals to solve your challenge.
Examples for customised solutions include fully automated metrology and inspection systems for large area substrates as long as 4 meters in length, as well as customised handling systems or tools that combine different measurment and inspection functions in one system. Customised solutions represent an important pillar of our business ever since the founding of the company at the beginning of the 1990s.
Examples
SPECTOR 5500
Used in: Front - END
Key Differences: Closed Frame Tool; Mask Defect inspection
Key Features:
Mikro defekt inspection on Masks
Rembrandt 200 / 300
Used in: Front-END and Back-End
Key Differences: Closed Frame Tool; TOOL FOR Wafer Imaging
Key Features:
Wafer Micro Imaging
DaVinci 270UV
Used in: Front - END
Key Differences: Closed Frame Tool; Mask CD Metrology
Key Features:
CD Measurement on Mask
Comprehensive Service. Optimal Performance.
Our specialized service technicians will be on site for
- tool installations
- undertaking maintenance
- tool repairs
- service trainings
Our highly competent service team creates quotes for
- spare parts only contracts
- full service contracts with guaranteed response times and dedicated spare parts
- tool upgrades